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Plasma Pretreatment and Inline Oxide Reduction Enhance Reliability and Yield in Power Module Manufacturing
Plasma treatment has become an essential enabler for next-generation power modules. By combining it with the REDOX -Tool's inline oxide reduction, manufacturers achieve contaminant-free, highly activated surfaces—resulting in stronger bonds, better thermal performance, and significantly fewer field failures.
Removes organic residues and metal oxides, improving solder wetting and bond integrity.
Increases surface energy to strengthen adhesion of wire bonds, die attach materials, and encapsulants.
Reduces reliance on chemical primers and fluxes, lowering contamination risks and simplifying production.
Compatible with automated manufacturing lines; real-time process control ensures consistent, repeatable treatment.
Supports void-free interfaces and improved thermal conductivity, reducing module hotspots and enhancing current-handling capacity.
Manufacturers using these combined technologies report up to 40% improvement in production yield and measurable reductions in field failures due to solder joint degradation or coating delamination.
This approach is particularly effective in:
Plasmatreat is the global leader in atmospheric plasma surface treatment technology, serving industries from automotive to electronics. The plasma innovations are trusted by leading global players in semiconductor and power electronics manufacturing to enhance bonding reliability, reduce contamination, and improve process efficiency.
Those interested in learning more about plasma applications will have the opportunity to do so at the productronica, hall A2, booth 445 and SEMICON Europa, hall B1, booth 136.
www.plasmatreat.com
View original content:https://www.prnewswire.co.uk/news-releases/plasma-pretreatment-and-inline-oxide-reduction-enhance-reliability-and-yield-in-power-module-manufacturing-302613154.html