Infineon SP37 Tire Pressure Monitoring Sensor - Technology Analysis

The latest generation of Infineon's TPMS, the SP37, is a highly integrated TPM sensor which embeds measurement of pressure and radial acceleration (2 DoF) with a low-power microcontroller, a LF receiver and an RF transmitter in a system in package integrating only two dies. This high integration of functions allows to build a complete system with few external components and thus enable system cost savings. The SP37 inherits its MEMS technology from the acquisition of the Norwegian Sensonor in 2003. Therefore, highly reliable measurements in harsh environments are possible by the use of the mature and low-cost triple stack hermetic wafer bonding technology in combination with buried piezoresistors and conductors. The SP37 is assembled in a Small Outline 14-pin package and operates under a temperature range of -40 to +125°C. This report will provide a Physical Analysis & Manufacturing Process Flow. A full reverse costing analysis report is also available, with a complete teardown of the...

The latest generation of Infineon's TPMS, the SP37, is a highly integrated TPM sensor which embeds measurement of pressure and radial acceleration (2 DoF) with a low-power microcontroller, a LF receiver and an RF transmitter in a system in package integrating only two dies. This high integration of functions allows to build a complete system with few external components and thus enable system cost savings.

The SP37 inherits its MEMS technology from the acquisition of the Norwegian Sensonor in 2003. Therefore, highly reliable measurements in harsh environments are possible by the use of the mature and low-cost triple stack hermetic wafer bonding technology in combination with buried piezoresistors and conductors.

The SP37 is assembled in a Small Outline 14-pin package and operates under a temperature range of -40 to +125°C.

This report will provide a Physical Analysis & Manufacturing Process Flow.

A full reverse costing analysis report is also available, with a complete teardown of the TPMS.

Key Topics Covered:

PHYSICAL ANALYSIS

Physical Analysis Methodology

Package

ASIC Die

MEMS Die

MANUFACTURING PROCESS FLOW

For more information visit http://www.researchandmarkets.com/research/vrgc69/infineon_sp37

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