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Picosun to introduce novel coating solution for organic electronics

Picosun research on an industrially viable ALD/MLD process was demonstrated on wafers and polymer substrates over 200 mm in diameter with a deposition temperature of 90 °C using Picosun ALD tools. The results showed great thickness uniformity and higher throughput compared to pure ALD film deposition. The MLD film proved to be stable in ambient environment and the complementary strengths of ALD and MLD hindered H2O permeation through the film stack, which enables flexibility in moisture barrier design.
Finland, (informazione.news - comunicati stampa - scienza e tecnologia)

Picosun research on an industrially viable ALD/MLD process was demonstrated on wafers and polymer substrates over 200 mm in diameter with a deposition temperature of 90 °C using Picosun ALD tools. The results showed great thickness uniformity and higher throughput compared to pure ALD film deposition. The MLD film proved to be stable in ambient environment and the complementary strengths of ALD and MLD hindered H2O permeation through the film stack, which enables flexibility in moisture barrier design.

"We are excited to bring these insights to the market as there has been little information available from stable and industrially viable MLD processes in full wafer scale. Besides organic electronics, we see immense potential with the ALD/MLD films in the manufacturing of LEDs, MEMS and medical packaging", states , VP, Industrial Business Area of Picosun Group.

Watch the Picosun webinar to learn more Wabout the topic and Picosun results:

More information:

Juhana Kostamo

Vice President, Industrial Business Area, Picosun Group

Tel: +358 50 369 9565

Email: info@picosun.com

www.picosun.com

This information was brought to you by Cision http://news.cision.com

https://news.cision.com/picosun-oy/r/picosun-to-introduce-novel-coating-solution-for-organic-electronics,c3471077

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