Scienza e Tecnologia
Bonding Sheet Market worth $551 million by 2027 - Exclusive Report by MarketsandMarkets™
https://www.marketsandmarkets.com/Market-Reports/bonding-sheet-market-105492554.html
Polyimide bonding sheet are polymer-based materials which are flexible, chemical resistant, heat resistant, and lightweight. They are primarily used for insulation and passivation in various applications in electronics/optoelectronics, automotive, and others. They have high mechanical and tensile strength due to which they are utilized in the manufacture of sensors, chips, wires, and cables.
Bonding sheet with adhesive thickness 25 µM offers heat-resistant properties and is thus ideal for fixing backing materials and terminals, FPCs, and stiffeners which are required to undergo heat treatment. Dexerials Corporation offers acrylic- and epoxy-based 25 µM bonding sheet under the brand, D3451 and is ideal for hot press, quick press, and oven-curing. NIKKAN INDUSTRIES Co., Ltd. offers thermosetting resin type bonding sheet under the brand, NIKAFLEX SA-series for multilayer FPCs.
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Bonding sheet are ideally used during the fabrication process of electronics materials such as printed circuit boards (PCBs), heat sinks, rigid-flex boards, FPCs, and others. Bonding sheet are designed to bond metal foils to base materials to create a laminate or layers of laminates in flexible printed circuits. They are manufactured in various adhesive thicknesses, materials, and applications. They are generally supplied in the form of rolls stored at temperatures ranging from 40 to 85°F in dry and clean environments to protect the bonding sheet from losing their functional characteristics.
APAC is the fastest-growing region for bonding sheet market. The region consists of the majority of emerging economies of the world such as China , Japan , India , South Korea , Malaysia , and Australia , and is projected to register the highest CAGR for bonding sheet in the next five years. The easy availability of raw materials, low labor costs, and a moderately stringent regulatory framework in these developing countries are some of the factors driving the market.
Major players operating in the global bonding sheet market include Arisawa Manufacturing Co. ( Japan ), DuPont (US), NIKKAN INDUSTRIES Co., Ltd. ( Japan ), Dexerials Corporation ( Japan ), Nitto Denko Corporation ( Japan ), Showa Denko Materials Co., Ltd. ( Japan ), Toray Industries, Inc. ( Japan ), NAMICS Corporation ( Japan ), and Shin-Etsu Polymer Co., Ltd. ( Japan ) among many others.
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Chemicals Market Research Reports & Consulting
by Application (Flexible Printed Circuits, Specialty Fabricated Products, Pressure-Sensitive Tapes, Motors/Generators, Wires & Cables), End-Use Industry (Electronics, Automotive), and Region - Global Forecast to 2026
https://www.marketsandmarkets.com/Market-Reports/polyimide-film-market-205319946.html
Market by Resin type (Acrylic, Rubber, Silicone), Category (Commodity, Specialty), Backing Material (Polypropylene, Paper, PVC), Type, End-Use Industry, and Region - Global forecast to 2022
https://www.marketsandmarkets.com/Market-Reports/pressure-sensitive-adhesive-tapes-market-93089164.html
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