JCET Posts Record Q3 Revenue, Profit Before Tax Up 29.3% Year-on-Year

In 2025, JCET accelerated efforts to upgrade advanced packaging capabilities and expand production capacity, while driving application-focused innovation and strengthening both global and local customer engagement. As a result, capacity utilization rose steadily from Q1 to Q3, reaching near-full levels across key product lines, including wafer-level packaging, power device packaging, and power management chip packaging. In 2025, JCET accelerated efforts to upgrade advanced packaging...

SHANGHAI, 23/10/2025 (informazione.news - comunicati stampa - elettronica)

In 2025, JCET accelerated efforts to upgrade advanced packaging capabilities and expand production capacity, while driving application-focused innovation and strengthening both global and local customer engagement. As a result, capacity utilization rose steadily from Q1 to Q3, reaching near-full levels across key product lines, including wafer-level packaging, power device packaging, and power management chip packaging.

Several business segments delivered strong year-on-year revenue growth in Q3 YTD 2025. Revenue from computing electronics, industrial and medical electronics, and automotive electronics rose by 69.5%, 40.7% and 31.3%, respectively. JCET's transformation continues to be driven by investment in high value-added areas, new product ramp-ups, and the expansion of mass production. With demand rebounding and utilization rates rising, the company plans to further optimize its product mix, prioritize capacity for high-margin products, and enhance overall profitability.

In the first three quarters of 2025, JCET significantly increased its R&D investment, with expenses rising 24.7% year-on-year to RMB 1.54 billion. The company achieved breakthrough progress in several critical technology areas, including co-packaged optics (CPO), glass substrates, large-format fcBGA packaging, and high-density system-in-package (SiP) solutions. In parallel, JCET continues to attract top global talent and strengthen its R&D capabilities, further solidifying the foundation for long-term innovation and sustainable growth.

For more information, please refer to the JCET Q3 2025 Report. 

About JCET Group

JCET Group is a global leader in integrated circuit back-end manufacturing and technology services. We provide comprehensive turnkey solutions, including semiconductor package integration design, wafer probing, bumping, assembly, final testing, and global drop shipments.

Utilizing advanced wafer-level packaging, 2.5D/3D packaging, System-in-Package solutions, and reliable flip chip and wire bonding technologies, we support a wide range of applications, including automotive, artificial intelligence, high-performance computing, storage, communication, smart devices, industrial and medical sectors, and power and energy. With cutting-edge R&D centers in China and Korea, and manufacturing facilities across China, Korea, and Singapore, we deliver efficient supply chain solutions and maintain close collaboration with our global customers.

 

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