Hengtong Optic-Electric releases 400G DR4 silicon photonic transceiver, enriching 400G transceiver module product series

Silicon photonic integrated circuits are one of the best solutions to realize the monolithic integration of photonic chips and electronic chips, the 400G silicon photonic chips are an advanced technology to break the bottleneck of mega-scale data exchange, showing great advantages in low power consumption, small footprint, relatively low cost, easiness for large volume integration, etc. With the rapid development of the next generation information and communication technology, it brings explosive growth of data communications. The 400G silicon photonic transceivers are expected to replace the traditional transceivers which are incapable to some extent. Particularly, in the era of Co-Packaged Optics (CPO), the silicon photonic solution will become the best choice. In the meantime, Hengtong also released the first prototype of 3.2T CPO switch based on silicon photonic technology in China, which is an important milestone in silicon photonic industry.

Silicon photonic integrated circuits are one of the best solutions to realize the monolithic integration of photonic chips and electronic chips, the 400G silicon photonic chips are an advanced technology to break the bottleneck of mega-scale data exchange, showing great advantages in low power consumption, small footprint, relatively low cost, easiness for large volume integration, etc. With the rapid development of the next generation information and communication technology, it brings explosive growth of data communications. The 400G silicon photonic transceivers are expected to replace the traditional transceivers which are incapable to some extent. Particularly, in the era of Co-Packaged Optics (CPO), the silicon photonic solution will become the best choice. In the meantime, Hengtong also released the first prototype of 3.2T CPO switch based on silicon photonic technology in China, which is an important milestone in silicon photonic industry.

In addition, Hengtong Rockley's 400G QSFP-DD FR4 transceiver also utilizes 7nm DSP chip, EML is used in transmitter side, and InP detector is used in receiver side, with the help of low-cost and mature WDM photonic device, making the entire module design and layout very compact. The power consumption is less than 9W.

Hengtong Rockley Technology Co., Ltd. is a joint venture established by Hengtong Optic-Electric Co., Ltd., China and Rockley Photonics Limited, UK. Hengtong Rockley designs and manufactures high-end optical modules. It is also committed to the design of silicon photonic chips and their integration, packaging, and testing, for improved competitiveness of optical module design and manufacturing.

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