Apple iPhone 5S Camera Module 8Mpixel 1.5m Stacked BSI CIS from Sony - Reverse Costing Analysis

http://photos.prnewswire.com/prnh/20130307/600769For the iPhone 5S iSight camera module, Apple continues to integrate a 8Mpixel resolution CMOS Image Sensor. They achieve to obtain 33% increase in light sensitivity by improving the camera aperture from f/2.4 to f/2.2 and by rising the pixel size from 1.4µm to 1.5µm.The unique technology from Sony (Exmor-RS) allows to raise the pixel array size by 15% and thus to considerably improve the light sensitivity by keeping a similar cost compared to the previous CIS. The technology consists in a stacking of two separate chips using optimized processes: a pixel array circuit which uses a Back-Side Illuminated (BSI) technology, and a logic ISP circuit processed with a 65nm technology node. The two circuits are stacked with a wafer bonding process and connected together with copper TSVs.The camera module, with dimensions of 8.5 x 7.8 x 5.7mm, is equipped with a 5-elements lens module and a VCM auto-focus actuator. The CIS is assembled in...

http://photos.prnewswire.com/prnh/20130307/600769

For the iPhone 5S iSight camera module, Apple continues to integrate a 8Mpixel resolution CMOS Image Sensor. They achieve to obtain 33% increase in light sensitivity by improving the camera aperture from f/2.4 to f/2.2 and by rising the pixel size from 1.4µm to 1.5µm.

The unique technology from Sony (Exmor-RS) allows to raise the pixel array size by 15% and thus to considerably improve the light sensitivity by keeping a similar cost compared to the previous CIS. The technology consists in a stacking of two separate chips using optimized processes: a pixel array circuit which uses a Back-Side Illuminated (BSI) technology, and a logic ISP circuit processed with a 65nm technology node. The two circuits are stacked with a wafer bonding process and connected together with copper TSVs.

The camera module, with dimensions of 8.5 x 7.8 x 5.7mm, is equipped with a 5-elements lens module and a VCM auto-focus actuator. The CIS is assembled in flip-chip on a ceramic substrate with a gold stud bumping process.

This report provides a complete teardown with:

Key Topics Covered:

CAMERA MODULE SUPPLY CHAIN & COMPANIES PROFILE

Physical Analysis

Camera Module

CMOS Image Sensor

Cross-Section: Camera Module

Cross-Section: CMOS Image Sensor

Comparison with previous 8Mpixel CIS from OVT, Samsung and Sony

CIS MANUFACTURING PROCESS FLOW

CMOS Image Sensor Cost

Camera Module Assembly Cost

Camera Module Cost

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