Elettronica
Picosun and A*STAR's IME to Create Novel, High Performance Memories
FeRAM and ReRAM are emerging memories whose potential benefits over the existing technologies are their non-volatility, simple structure, and lower power usage. However, this far their relatively higher production costs and reliability issues have been the main hindrances to their large-scale breakthrough.
ALD is an ideal method to manufacture ultra-thin and high-density material structures with unmatched quality, purity, structural integrity, and atomic level tailored composition. These attributes have great potential to solve the challenges in FeRAM and ReRAM manufacturing, and can lower the manufacturing costs for the same memory capacity. ALD's mature position in semiconductor industries supports its implementation in novel memory chip production as well.
"IME continues to spearhead the development of novel and advanced microelectronics technologies. We look forward to continuing our on-going partnership with Picosun in developing state-of-the-art FeRAM and ReRAM solutions to an emerging market, and benefit industry partners in the local ecosystem," says Professor Dim-Lee Kwong, Executive Director of IME.
"We are glad to work together with IME in the fascinating field of novel memory technologies. Singapore is one of our key hubs in Asia and IME our esteemed customer for years. This collaboration will create new innovations and practises in modern memory chip manufacturing and sharpen our competitive edge in the business," says Mr. Jussi Rautee, CEO of Picosun Group.
Mr. Juhana Kostamo
Deputy CEO, Picosun Group
Tel: +358 50 3699 565
Email: juhana.kostamo@picosun.com
Mr. Edwin Wu
CEO, Picosun Asia Pte. Ltd.
Tel: +358 40 480 3449
Email: xiaopeng.wu@picosun.com
Minna Toivola
D.Sc., Marketing Manager, Picosun Oy
Email: minna.toivola@picosun.com
Tel: +358 40 758 8748
This information was brought to you by Cision http://news.cision.com
https://news.cision.com/picosun-oy/r/picosun-and-a-star-s-ime-to-create-novel--high-performance-memories,c3108235
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