Chiplets Market Valuation to Reach US$ 47.19 Bn by 2031 - Transparency Market Research

ALBANY, N.Y., Oct. 7, 2021 /PRNewswire/ -- ALBANY, N.Y.,Oct. 7, 2021/PRNewswire/ -- Chiplets Market: Broad Contours Chiplet assembly approaches are attracting immense attention among businesses in the semiconductor industry and foundries. Advancements in tools and methodologies for chip and package designing have enabled them to overcome the limitations of traditional system-on-chip (SoC), and have spurred the shift toward multi-chiplet architectures. The demand for advanced IC...

ALBANY, N.Y., Oct. 7, 2021 /PRNewswire/ --

Chiplets Market: Broad Contours

Chiplet assembly approaches are attracting immense attention among businesses in the semiconductor industry and foundries. Advancements in tools and methodologies for chip and package designing have enabled them to overcome the limitations of traditional system-on-chip (SoC), and have spurred the shift toward multi-chiplet architectures. The demand for advanced IC packaging in terms of performance or efficiency is driving R&D activities in the chiplets market.

The increased adoption of 3D die stacking techniques has reduced turnaround time and design efforts, and eventually allowed electronic product designers to build up a powerful circuitry for next-gen electronics. Numerous benefits of chiplet are fueling its demand among end-use industries, such as high manufacturing yield and cost reduction considerably.

The global chiplets market is projected to advance at a CAGR of 40.9% from 2021 to 2031, and is estimated to reach US$ 47.19 Bn by 2031. Microprocessor (MPU) chiplets will pave the way for advanced circuitry for electronics in various end-use industries.

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Key Findings of Chiplets Market Study

Chiplet-based Architectures to Reduce Costs, Overcome Performance Constraints of Traditional System-on-Chip (SoC): The high cost of designing a large number of monolithic SoCs has propelled the need for advancing the IC packaging. This has intensified research on chiplet assembly-based processors. The heterogeneous design has led semiconductor packaging companies to disaggregate the SoC architecture and then reintegrate the chiplets on to a single substrate. The demand for low-cost alternatives to SoC is high in the automotive and consumer electronics applications, offering potential gains to players in the chiplets market. Particularly, chiplets with small functional dies are proving to be promising for modern sub 10nm (nanometer) transistor features for building up a high-performance circuitry that has SoC-like low-latency but built at lower cost and in less time.

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Microprocessor Suppliers Aim at Commercialization of Chiplets, Faster Time-To-Market Key Advantage: The gains that a heterogenous integration of chiplets offers for low-cost customization of electronics hardware for a wide range of applications will speed up mainstreaming of chiplet-based architectures in the near future. Some of the emerging applications microprocessor suppliers and foundries in the chiplets market are focusing on are advanced system on chip devices, graphic processing units (GPUs), and programmable logic devices (PLDs). In developed nations, the demand for the next-gen military technology will increasingly accelerate the efforts of commercialization of products in the chiplets market.

Chiplets Market: Drivers

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Chiplets Market: Regional Growth Dynamics

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Chiplets Market: Competition Dynamics

Some of the key players in the chiplets market are Xilinx, Taiwan Semiconductor Manufacturing Company Ltd., NXP Semiconductors, NHanced Semiconductors, Inc., Netronome, Marvell Technology Group, and Intel Corp.

Global Chiplets Market: Segmentation

Chiplets Market, by Application

Chiplets Market, by End-use Industry

Chiplets Market, by Region

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