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STMicroelectronics in Cooperation with Soitec Makes 28nm FD-SOI CMOS Process Available Through CMP

Semiconductor technology leaders ST, Soitec and CMP help universities, research labs and companies prototype next generation of Systems-on-Chip Geneva and Grenoble, October 18, 2012 - STMicroelectronics (NYSE:STM), Soitec (Euronext) and CMP (Circuits Multi Projets®) today announced that ST's CMOS 28nm Fully Depleted Silicon-On-Insulator (FD-SOI) process, which uses innovative silicon substrates from Soitec, is now available for prototyping to universities, research labs and design companies through the silicon brokerage services provided by CMP...
New York, (informazione.news - comunicati stampa - elettronica)

Se m icond u c t or tec h nol o gy leaders ST, Soitec a nd CMP help un i versiti e s, r e s e arch la b s and co m pani e s pr ototype n ext gen e ration of Syste m s-on - Chip

 

Geneva and Grenoble, October 18, 2 0 12 - STMicroelectronics ( NYSE:STM), Soitec (Euronext) and CMP (Circuits Multi Projets®) t o day ann o unced that ST's CMOS 28nm Fully Depleted Sili c on-On-Insulator (FD-SOI) process, which uses innovative silicon substrates from Soitec, is now avail a ble for prototypi n g to universities, research labs and design companies through the silicon b r oke r age services provided by CMP. ST is releasing this process technology to third parties as it nears completion of its first commercial wafers.

 

The introdu c tion in CMP's catalogue of ST's 2 8nm FD-SOI CMOS process builds on the successful collaboration t hat has allowed univ e rsities and design firms to access previous C M OS gener a tions including 45nm (introduced in 2008), 65nm (intro d uced in 2006), 90nm (introduced in 2004 ) , and 130nm (intro d uced in 2003). CMP's clients also have access to 65 n m and 13 0 nm SOI (Sili c on-On-Insulator), as well as 130nm SiGe processes from STMicroelectronics. For e x ample, 170 univ e rsities and other compan i es have r e ceived the design ru l es and design kits for the ST 90nm CMOS process, and more than 200 universities and companies h ave received the design rules and d esign kits f o r the ST 65nm bulk and S OI CMOS processes.

 

Since CMP started offering the ST 28nm CMOS bulk technology in 2011, some 60 universities and microelectronics companies have received the design rules and design kits and 16 integrated circuits (ICs) have already been manufactured.

 

"There h as been a g re a t interest in designing I C s using these p r ocesses, with about 3 0 0 projects having been desig n ed in 90nm (phased out in 2009), and more than 300 alrea d y in bulk 65nm," said Bernard C ourtois, Direct o r of CMP. "In addition, more than 60 pr o j ects have alre a dy be en desig n ed in 65nm S O I and it is interesting to n ote that many t o p universities in Europe, USA/Canada and Asia have already tak e n adv a ntage o f the collaboration between CMP and ST."

 

The CMP multi-pr o j ect wafer service allows orga n izations to obtain sm a ll q uantities--ty p ically from a few dozens to a few thousand u nits--of adv a nced ICs. T h e cost of the 28nm FD-SOI CMOS process h as been fix e d to 18,000 EUR/m m , with a minimum of 1mm .

 

"With the first designs in FD-SOI technology already in the pipeline, the time is right to make the technology available to the research communities. Our FD-SOI manufacturing process allows existing designs to be quickly and easily ported to FD-SOI where significant power and performance benefit can be realized ," said Philippe Magarshack, Executive Vice President, Design Enablement and Services, STMicroelectronics. "In addition, ensuring that univ e rsities have access to our leading- e dge technolog i es can help us a ttract the best young e n gineers as p ar t of our commitment to remain a tec h nolo g y le a d e r on a long-term basis."

 

"Our partnership with STMicroelectronics and CMP is an additional example of Soitec's commitment to providing differentiated materials solutions to the open market, supporting the continual expansion of the FD-SOI ecosystem and users of advanced technologies," said Steve Longoria, senior vice president of worldwide strategic business development for Soitec. "Through this partnership we will see new and innovative products based on Soitec's FD-SOI materials, as a result of providing universities and other customers with a proven path for developing and testing next-generation integrated circuits."

 

 

About STMicroelectronics

ST is a global leader in the semiconductor market serving customers across the spectrum of sense and power technologies and multimedia convergence applications. From energy management and savings to trust and data security, from healthcare and wellness to smart consumer devices, in the home, car and office, at work and at play, ST is found everywhere microelectronics make a positive and innovative contribution to people's life. By getting more from technology to get more from life, ST stands for life .augmented.

 

In 2011, the Company's net revenues were $9.73 billion. Further information on ST can be found at www.st.com.

 

 

About Soitec

Soitec is an international manufacturing company, a world leader in generating and manufacturing revolutionary semiconductor materials at the frontier of the most exciting energy and electronic challenges. Soitec's products include substrates for microelectronics (most notably SOI: Silicon-on-Insulator) and concentrator photovoltaic systems (CPV). The company's core technologies are Smart Cut(TM), Smart Stacking(TM) and Concentrix(TM), as well as expertise in epitaxy. Applications include consumer and mobile electronics, microelectronics-driven IT, telecommunications, automotive electronics, lighting products and large-scale solar power plants. Soitec has manufacturing plants and R&D centers in France, Singapore, Germany and the United States. For more information, visit: www.soitec.com .

 

 

About CMP

CMP is a broker in ICs a nd MEMS f o r prototypi n g and low vo l ume pro d uction. Cir c uits are fabricat e d for Univ e rsities, Research L abo r atories and In d ustrial Comp a ni e s. Advanced industrial technologies a re avail a ble in CMOS, Bi C MOS, SiGe BiCMOS, H i gh Voltage, FD-SOI down to 20nm, pHEMT GaAs, and MEMS etc. CMP distrib u tes and supports several CAD software tools f o r b oth Industrial Companies and Univ e rsities. Since 1981, more t han 1000 Instituti o ns from 70 countr i es have been se r v ed, more than 6,000 p r ojects have be e n prototyp e d through 7 00 runs, and 60 different technologies have b e en interfaced. For more info r mation, visit: http://cmp.imag.fr.

 

 

For more information contact:

 

 

STMicroelectronics
Michael Markowitz
+1 781 591 0354
michael.markowitz@st.com

 

Soitec
Camille Darnaud-Dufour
+33 679 49 51 43
Camille.darnaud-dufour@soitec.com

 

CMP

Bernard Courtois

+33 4 76 57 46 15

Bernard.Courtois@imag.fr
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