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Semiconductor And IC Packaging Material Market Is Expected to be worth Around USD 34.8 Billion By 2025 - Zion Market Research
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The integrated circuits and semiconductors usage ensures better performance and these are widely utilized in the electronics industry. Furthermore, the increasing population acts as a catalyst for this market along with the growing consumer spending on electronic devices and the latest gadgets. Additionally, the development of packaging material for mobile phones and other gadgets is growing, which is also contributing to this market. However, difficulty in implementing new technologies and latest packaging materials in small companies might slow down the semiconductor and IC packaging material market.
On the basis of type, organic substrates are anticipated to hold a sizable share of the semiconductor and IC packaging material market. This can be attributed to their increasing demand in the packaging industry as it is moving toward using less packaging materials. Thus, these substrates are replacing bonding wires and lead frames and increasingly gaining market shares. Moreover, organic substrates are flexible and have a wide range of applications, which is further expected to fuel this segment's growth.
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On the basis of technology, the DFN (Dual Flat No Leads) package is predicted to hold a considerable market share. DFN has shorter bond wire lengths that help in providing better electrical performance owing to less inductance as compared to other leaded packages. DFN also has pads that range from 3 to 32.
The Asia Pacific semiconductor and IC packaging material market is predicted to hold a notable share in the future. The implementation of semiconductors and ICs is high in Japan , China , Taiwan , and South Korea . Moreover, is the availability of labor and raw materials at economical prices in the region and a large population base are also propelling this regional market.
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Some key players of the semiconductor and IC packaging material market globally are Amkor Technology, DuPont, Henkel, Honeywell, Toppan Printing, Hitachi Chemical, Kyocera Chemical, LG Chemical, Alent, BASF, Sumitomo Chemical, Toray Industries Corporation, Mitsui High-Tec, and Tanaka Holdings.
This report segments the global semiconductor and IC packaging material market into:
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