The Global Market for Equipment and Materials for IC Manufacturing.

This report examines and projects the technology of equipment and materials involved in the fabrication of VLSI semiconductor devices, their likely developments, why and when their introduction or demise will take place, what problems and choices are facing users, and where the opportunities and pitfalls are. This report discusses the technology trends, products, applications, and suppliers of chemicals (liquids and gases) and equipment (lithography, plasma etching, and CMP). It also gives insights to suppliers for future user needs and should assist them in long range planning, new product development and product improvement.

This report examines and projects the technology of equipment and materials involved in the fabrication of VLSI semiconductor devices, their likely developments, why and when their introduction or demise will take place, what problems and choices are facing users, and where the opportunities and pitfalls are.

This report discusses the technology trends, products, applications, and suppliers of chemicals (liquids and gases) and equipment (lithography, plasma etching, and CMP).

It also gives insights to suppliers for future user needs and should assist them in long range planning, new product development and product improvement.

Key Topics Covered:

Chapter 1 Introduction

Chapter 2 Low-K Dielectric Issues and Trends

2.1 Introduction
2.2 Ideal Dielectric
2.3 Types of Low-K Dielectrics
2.4 Summary

Chapter 3 Lithography Issues And Trends

3.1 Optical Systems
3.2 X-Ray Systems
3.3 Electron Beam Systems
3.4 Ion Beam Systems
3.5 Nano-Imprint Lithography
3.6 New Technologies
3.7 Evaluation of Lithography Cost of Ownership

Chapter 4 CMP Issues and Trends

4.1 Need for Planarity
4.2 Applications
4.3 Planarization Techniques
4.4 Chemical Mechanical Polishing (CMP)

Chapter 5 Factory Automation Issues and Trends

5.1 Introduction
5.2 Elements of Automation
5.3 Flexible Automation
5.4 Reliability
5.5 Tool Issues and Trends
5.6 E-Manufacturing

Chapter 6 Thin film Deposition Issues and Trends

6.1 Physical Vapor Deposition
6.2 Chemical Vapor Deposition (CVD) Techniques

Chapter 7 Plasma Etching Issues and Trends

7.1 Introduction
7.2 Processing Issues
7.3 Plasma Stripping

Chapter 8 Chemicals and Materials Issues and Trends

8.1 Technology Issues
8.2 Purity Requirements
8.3 Chemical Management
8.4 Gases
8.5 Sputtering and Evaporation Materials

Chapter 9 Metrology

9.1 Defect Review/Wafer Inspection
9.2 Thin Film Metrology
9.3 Lithography Metrology

Chapter 10 Lithography For Wafer Level Packaging (WLP)

10.1 Issues
10.2 Exposure Systems
10.3 Competitive Technologies

Chapter 11 Market Forecast

11.1 Market Drivers
11.2 Market Forecast Assumptions
11.3 Low-K Market
11.4 Lithography Market
11.5 CMP Market
11.6 Factory Automation Market
11.7 Thin Film Deposition Market
11.8 Plasma Etching Market
11.9 Chemical and Materials Market
11.10 Metrology Market
11.11 Lithography for Wafer Level Packaging (WLP)


For more information visit http://www.researchandmarkets.com/research/qs98j2/the_global_market

Media Contact: Laura Wood , +353-1-481-1716, [email protected]