Design Analysis Nokia Solutions Networks FSME LTE Baseband Unit

http://photos.prnewswire.com/prnh/20130307/600769This report covers the design analysis of a Nokia Solutions Networks FSME LTE digital baseband unit. This unit is part of the Flexi eNodeB system. The unit was manufactured in Q3 of 2010. Key Findings:
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http://photos.prnewswire.com/prnh/20130307/600769

This report covers the design analysis of a Nokia Solutions Networks FSME LTE digital baseband unit. This unit is part of the Flexi eNodeB system. The unit was manufactured in Q3 of 2010.

Key Findings:

Component and semiconductor suppliers mentioned in this report include: Amphenol, AVX, Epson Toyocomm, Fairchild Semiconductor, Infineon Technologies, Molex, NXP Semiconductors, Pulse Electronics, Samsung Semiconductors, STMicroelectronics, Texas Instruments, and Vishay Semiconductors.

Features:

Key Topics Covered:

EXECUTIVE SUMMARY
Active/Passive Component Summary
Important Note:

CHAPTER 1: NOKIA FLEXI MULTIRADIO BTS SYSTEM
Overview of Nokia Flexi Product Offering

CHAPTER 2: FSME MECHANICAL ANALYSIS
Mechanical Analysis

CHAPTER 3: FLEXI POWER DISTRIBUTION AND FUSES MODULE (FPFB)

CHAPTER 4: FCM SUB SYSTEM

CHAPTER 5: FSP SUB SYSTEM

CHAPTER 6: FAN UNIT

APPENDIX A - PASSIVE CASE SIZE ANALYSIS
APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS

TABLES
Table 1: FPFB Bill of Materials
Table 2: FCM PCB Top Bill of Materials
Table 3: FCM PCB Top Missing Component Bill of Materials
Table 4: FCM PCB Bottom Bill of Materials
Table 5: FCM PCB Bottom Missing Component Bill of Materials
Table 6: FCM PCB Bottom Missing Connector Bill of Materials
Table 7: FSP Top Bill of Materials
Table 8: FSP Top View Missing Component Bill of Material
Table 9: FSP Bottom Bill of Materials
Table 10: FSP Bottom Missing Component Bill of Materials
Table 11: FSP Bottom Missing Component, Area A Bill of Materials
Table 12: FSP Bottom Missing Connector Bill of Materials
Table 13: Passive Component Case Size Distribution by System Subsection
Table 14: Identified Passive Component Supplier Distribution by System Subsection
Table 15: Active/Passive Component Distribution by System Subsection
Table 16: Active Semiconductor/Component Vendor Distribution by System Subsection

Companies Mentioned:

For more information visit http://www.researchandmarkets.com/research/jbpkgx/design_analysis

Media Contact: Laura Wood , +353-1-481-1716, [email protected]

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