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Design Analysis Nokia Solutions Networks FSME LTE Baseband Unit

http://photos.prnewswire.com/prnh/20130307/600769This report covers the design analysis of a Nokia Solutions Networks FSME LTE digital baseband unit. This unit is part of the Flexi eNodeB system. The unit was manufactured in Q3 of 2010. Key Findings:
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http://photos.prnewswire.com/prnh/20130307/600769

This report covers the design analysis of a Nokia Solutions Networks FSME LTE digital baseband unit. This unit is part of the Flexi eNodeB system. The unit was manufactured in Q3 of 2010.

Component and semiconductor suppliers mentioned in this report include: Amphenol, AVX, Epson Toyocomm, Fairchild Semiconductor, Infineon Technologies, Molex, NXP Semiconductors, Pulse Electronics, Samsung Semiconductors, STMicroelectronics, Texas Instruments, and Vishay Semiconductors.

Features:



EXECUTIVE SUMMARY
Active/Passive Component Summary
Important Note:

CHAPTER 1: NOKIA FLEXI MULTIRADIO BTS SYSTEM
Overview of Nokia Flexi Product Offering

CHAPTER 2: FSME MECHANICAL ANALYSIS
Mechanical Analysis

CHAPTER 3: FLEXI POWER DISTRIBUTION AND FUSES MODULE (FPFB)

CHAPTER 4: FCM SUB SYSTEM

CHAPTER 5: FSP SUB SYSTEM

CHAPTER 6: FAN UNIT

APPENDIX A - PASSIVE CASE SIZE ANALYSIS
APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS

TABLES
Table 1: FPFB Bill of Materials
Table 2: FCM PCB Top Bill of Materials
Table 3: FCM PCB Top Missing Component Bill of Materials
Table 4: FCM PCB Bottom Bill of Materials
Table 5: FCM PCB Bottom Missing Component Bill of Materials
Table 6: FCM PCB Bottom Missing Connector Bill of Materials
Table 7: FSP Top Bill of Materials
Table 8: FSP Top View Missing Component Bill of Material
Table 9: FSP Bottom Bill of Materials
Table 10: FSP Bottom Missing Component Bill of Materials
Table 11: FSP Bottom Missing Component, Area A Bill of Materials
Table 12: FSP Bottom Missing Connector Bill of Materials
Table 13: Passive Component Case Size Distribution by System Subsection
Table 14: Identified Passive Component Supplier Distribution by System Subsection
Table 15: Active/Passive Component Distribution by System Subsection
Table 16: Active Semiconductor/Component Vendor Distribution by System Subsection

For more information visit http://www.researchandmarkets.com/research/jbpkgx/design_analysis

Laura Wood , +353-1-481-1716, press@researchandmarkets.net

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