E&R Showcases Next-Gen Laser and Plasma Solutions with Strategic Partners at SEMICON SEA 2025 in Singapore

Featured Technologies from E&R: Featured Technologies from E&R: Plasma Dicing – Small Die Dicing SolutionE&R delivers a hybrid laser grooving and plasma dicing solution that supports ultra-fine dice lanes (10–30 μm). Beyond equipment, E&R also provides a turnkey dicingservice, handling unique shapes like hexagons, circles, or MPR layouts with precision and consistency. FOPLP – Fan-Out Panel Level Packaging (700 × 700 mm)E&R's total solution supports large panel...

Singapore, 09/05/2025 (informazione.news - comunicati stampa - elettronica)

E&R delivers a hybrid laser grooving and plasma dicing solution that supports ultra-fine dice lanes (10–30 μm). Beyond equipment, E&R also provides a turnkey dicing , handling unique shapes like hexagons, circles, or MPR layouts with precision and consistency.

E&R's total solution supports large panel processes including laser marking, laser cutting, laser descum, plasma cleaning, and post-drill de-smear, with a remarkable warpage control up to 16 mm. The process is further enhanced with laser debonding and plasma dry etching solutions for separation of glass carrier and panel.

E&R leads in glass core process equipment, offering:

Join us at SEMICON SEA 2025 to see how E&R, Zen Voce, and GP Group are driving the future of semiconductor manufacturing — with more precise, efficient, and integrated solutions.

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