2019 Global Semiconductor Equipment Sales Slip 7 Percent to $59.8 Billion, SEMI Reports

Global sales of wafer processing equipment fell 6 percent in 2019, while other front-end segment sales grew 9 percent. Assembly and packaging along with test equipment sales also faltered, declining 27 percent and 11 percent, respectively, while sales to China rose across all major equipment segments except for assembly and packaging. Global sales of wafer processing equipment fell 6 percent in 2019, while other front-end segment sales grew 9 percent. Assembly and packaging along with test...

Global sales of wafer processing equipment fell 6 percent in 2019, while other front-end segment sales grew 9 percent. Assembly and packaging along with test equipment sales also faltered, declining 27 percent and 11 percent, respectively, while sales to China rose across all major equipment segments except for assembly and packaging.

Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the Worldwide SEMS Report is a summary of the monthly billings figures for the global semiconductor equipment industry. Categories cover wafer processing, assembly and packaging, test, and other front-end equipment. Other front-end includes mask/reticle manufacturing, wafer manufacturing, and fab facilities equipment.

Annual Billings by Region in Billions of U.S. Dollars with Year-Over-Year Rates

Source: SEMI (www.semi.org) and SEAJ (www.seaj.or.jp), April 2020

The SEMI Equipment Market Data Subscription (EMDS) provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports:

For more information or to subscribe, please contact the SEMI Industry Research and Statistics Group at [email protected]. More information is also available online.  

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SEMI^® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

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