Elettronica
ISIG Honors Dr. Kangwook Lee of SK hynix with 2025 Hall of Fame Award at I.S.E.S. Korea
Dr. Lee played a central role in ushering in the era of 3D TSV stacked memory. In 2019, he introduced the during HBM2E development, significantly enhancing thermal performance and reliability in stacked memory devices. Since joining SK hynix in 2018, he has led packaging innovations that position the company at the forefront of .
Previously, Dr. Lee held leadership roles at Samsung Electronics, Amkor Technology Korea, and Tohoku University. He has authored over , delivered more than , and holds , making him one of the most influential voices in advanced packaging.
Dr. Lee's impact has been recognized worldwide. In 2024, he became the , and in early 2025, he was honored with the in the Device and Process category — the first packaging executive ever to do so.
said .
Founded in 2010, ISIG is a global association organizing the across North America , Europe , the Middle East , and Asia . Endorsed by governments and supported by industry leaders, ISIG provides a platform for senior executives to .
For more information, visit www.isesglobal.com
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