JCET Group Subsidiary Recognized for Excellence by Texas Instruments

Mr. Jerry Zhang, General Manager of JCAP stated, "It is our great honor to receive this award for the fourth time. The supplier excellence award represents TI's confirmation and recognition of JCAP's Bump & WLP technologies and high volume production services. Being a global leading packaging and testing company, JCET Group always promotes innovation, assures the highest quality, and on-time delivery with advanced patented technologies. JCET Group will continue to concentrate on research, development and innovation to add more high-end packaging technologies to our portfolio, and work closely together with our customers for continuous improvement and excellence."  

Mr. Jerry Zhang, General Manager of JCAP stated, "It is our great honor to receive this award for the fourth time. The supplier excellence award represents TI's confirmation and recognition of JCAP's Bump & WLP technologies and high volume production services. Being a global leading packaging and testing company, JCET Group always promotes innovation, assures the highest quality, and on-time delivery with advanced patented technologies. JCET Group will continue to concentrate on research, development and innovation to add more high-end packaging technologies to our portfolio, and work closely together with our customers for continuous improvement and excellence."  

About JCET Group:

JCET Group is a leading global semiconductor system integration packaging and test provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.

About JCAP

As one of the core business units of JCET Group, Jiangyin Changdian Advanced Packaging Co., LTD. (JCAP) is focused on mid-end semiconductor packaging and test technologies and providing the highest quality service for our global customers.

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