Elettronica
Integrated Passive Device Market Worth 1370.1 Million USD by 2022
http://www.marketsandmarkets.com/Market-Reports/integrated-passive-device-market-43468224.html
The major factors driving the growth of the integrated passive device (IPD) market include the increasing adoption of IPDs in consumer durable products and integration of IPDs in RF applications.
Baluns accounted for the largest share of the integrated passive device (IPD) market in 2015, and the same trend is expected to continue in the coming years. The growth of this market can be attributed to the wide usage of baluns in almost all applications, wherein IPDs are used. Also, the demand for customized baluns with inbuilt filters is increasing; this is contributing to the growth of the market for baluns.
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The growth of the integrated passive device market for RF-IPD can be attributed to the surge in demand for miniaturized/compact consumer electronics (such as smartphones, tablets, and wearable devices) worldwide. In these electronics gadgets, RF front-end module or MODEM is the main part of the internal system. To achieve miniaturization, manufacturers prefer integrated passive devices-equipped modules over its predecessor technologies.
The presence of fabrication as well as IPD manufacturers is driving the growth of the IPD market in Europe . Europe, in EMEA, has a decent demand for IPD products as it is an early adopter of new technologies. The presence of established smartphone, wearable device, and consumer electronics manufacturers in this region is one of the key factors driving the growth of the IPD market in EMEA.
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The report also profiles the most promising players in this market. The competitive landscape of the market presents an interesting picture wherein a large number of players have become a force to reckon with. The key players in this market include On Semiconductor (U.S.), Stats ChipPAC ( Singapore ), STMicroelectronics ( Switzerland ), Murata-IPDiA ( Japan ), Johanson Technology (U.S.), Onchip Devices (U.S.), AFSC ( Taiwan ), and Infineon ( Germany ).
by Equipment (Placement, Inspection, Soldering, Screen Printing, Cleaning, Repair & Rework), Application (Consumer Electronics, Automotive, Aerospace & Defense), and Geography - Global Forecast to 2022
http://www.marketsandmarkets.com/Market-Reports/surface-mount-technology-market-99662691.html
by Application (Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Power), Packaging Technology (3D Wafer-Level Chip-Scale Packaging, 3D TSV, 2.5D), End-User Industry, and Region - Global Forecast to 2022
http://www.marketsandmarkets.com/Market-Reports/3dic-25d-tsv-interconnect-for-advanced-packaging-market-130814873.html
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