Elettronica
E&R Highlights Laser and Plasma Technologies for Advanced Packaging at SEMICON Taiwan 2025
E&R provides a full equipment portfolio, including laser marking, dicing, plasma cleaning, laser debonding, and ABF drilling, supporting panels up to 700×700 mm. With precision control, the systems maintain productivity while stably processing substrates with warpage up to 16 mm.
With the rise of 3D packaging and advanced memory, TSV has become essential for high-density integration. E&R delivers via drilling, cleaning, and debonding solutions that combine laser and plasma to achieve accurate via profiles, low defectivity, and reliable interconnects across wafer sizes and materials.
In the emerging glass core substrate segment, E&R's laser modification achieves > 0.9 via circularity, 10:1 aspect ratios, and 1,500 vias/sec drilling. The solution supports CoPoS and ABF substrate applications, enabling high-performance, high-yield manufacturing. In partnership with E-core partners, E&R will also showcase a complete metallization - enabled glass substrate process flow at the show.
Designed, manufactured, and qualified in Taiwan with components from leading U.S. and European suppliers, E&R equipment has shipped over 500 units worldwide. Its solutions are widely adopted in by major OSATs and IDMs. The company also expanded its , offering Pre-Flip Chip Die Bond Plasma Cleaning, Pre-Molding/Underfill Plasma Cleaning and Laser Marking for traceability. In 2025, E&R introduced a fully automated , supporting up to 3,000W test environments.
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